发明名称 COMPOUND, POLYMERIC COMPOUND, POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a novel polymeric compound which can be used as a base composition for a positive resist composition; a compound which is useful as a monomer for the polymeric compound; a positive resist composition containing the polymeric compound; and a method of forming a resist pattern using the positive resist composition. <P>SOLUTION: The compound is represented by general formula (I). The polymeric compound has a structural unit (a0) represented by general formula (a0-1). In general formula (I), R<SP POS="POST">1</SP>is a hydrogen atom, a lower alkyl group or a halogenated lower alkyl group; A is a &ge;2C divalent hydrocarbon group (other than a group obtained by removing two hydrogen atoms from adamantane) which may have a substituent (other than an oxygen atom (=O)); B is a &ge;1C divalent hydrocarbon group which may have a substituent; and R<SP POS="POST">2</SP>is an acid dissociable, dissolution inhibiting group. In general formula (a0-1), R<SP POS="POST">1</SP>is a hydrogen atom, a lower alkyl group or a halogenated lower alkyl group; A is a &ge;2C divalent hydrocarbon group (other than a group obtained by removing two hydrogen atoms from adamantane) which may have a substituent (other than an oxygen atom (=O)); B is a &ge;1C divalent hydrocarbon group which may have a substituent; and R<SP POS="POST">2</SP>is an acid dissociable, dissolution inhibiting group. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012255161(A) 申请公布日期 2012.12.27
申请号 JP20120168835 申请日期 2012.07.30
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHIONO HIROHISA;DAZAI NAOHIRO;SHIMIZU HIROAKI
分类号 C08F20/26;G03F7/039;H01L21/027 主分类号 C08F20/26
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