PRINTING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE USING THE SAME

摘要

PURPOSE: A printing apparatus and method for manufacturing semiconductor package substrate are provided not to contain solder paste remnant in the printing apparatus and substrate at the end of printing spot when the clamp located at the end of printing spot descends to the substructure of substrate. CONSTITUTION: A printing apparatus comprises a printing table(101), squeegee(111,112), a pair of clamp members(120, 130). A substrate formed with the printing dry film is arranged in the superstructure of the printing table. The squeegee prints a bump in the substrate. The clamp members comprise the first clamp member and the second clamp member. The first clamp member and the second clamp member ascend or descend with an inclined surface at its point of meeting.