| 摘要 |
PURPOSE: A heat sink is provided to radiate effectively the heat of a semiconductor chip by using heat radiation pins. CONSTITUTION: A heat radiation member(20) releases the heat of an electronic component. A clip member(30) is combined with the heat radiation member. The clip member fixes the electronic component at the heat radiation member. Heat radiation pins is formed at both ends of the heat radiation member. The heat radiation pin is alternatively arranged each other.
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