BUILT-IN ELECTRONIC DEVICE AND METHOD OF MAKING BUILT-IN ELECTRONIC DEVICES

摘要

FIELD: information technologies.SUBSTANCE: device 1 comprises a printed circuit board 10 with upper (11) and lower surfaces (12); scheme elements (20) on the upper surface (11), on the lower surface (12) there are separators (13); a lower coating (30), an upper coating (40) above the upper surface (10) and a basic layer (50) between the upper surface (11) and the upper coating (40).EFFECT: method improvement.20 cl, 5 dwg