发明名称 OPENING/CLOSING DEVICE OF SUBSTRATE TRANSFER CONTAINER, OPENING/CLOSING DEVICE OF LID AND SEMICONDUCTOR MANUFACTURING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To reduce the wear of a seal member 56 provided between an opening/closing region S3 and a loading area S2, while reducing the mechanisms required for a lid opening/closing mechanism 20 that attaches a lid removably, when opening/closing (removably attaching) the lid 3 of a hermetically sealed FOUP 1. <P>SOLUTION: A cylindrical body 5a is connected airtightly to the sidewall 4 so that the opening end of a conveyance port 5 on the loading area S2 side is oriented obliquely upward. A cover member 23 is configured to be moved up and down freely together with a lifting substrate 22, and a rotor 41 is provided in the cover member 23. The rotor 4 is guided by a guide 61 so that the cover member 23 moves perpendicularly to the aperture plane of a cylindrical body 5a while descending together with the lifting substrate 22, when the lifting substrate 22 descends. Guide members 26 are provided between the cover member 23 and the lifting substrate 22 in order to regulate the position of a door member when the cover member 23 moves toward the cylindrical body 5a. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012256645(A) 申请公布日期 2012.12.27
申请号 JP20110127539 申请日期 2011.06.07
申请人 TOKYO ELECTRON LTD 发明人 KOYAMA KATSUHIKO;HISHITANI KATSUYUKI;TAKEUCHI YASUSHI
分类号 H01L21/677;B65G49/00;B65G49/07 主分类号 H01L21/677
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