| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits defects at the time of dicing by using a semiconductor substrate having a TEG pattern. <P>SOLUTION: A semiconductor device comprises: a semiconductor substrate singlulated or to be singulated into semiconductor chips 2a by dicing; an inter layer insulation layer formed on the semiconductor substrate; a seal ring 5a provided in the interlayer insulation layer and formed along a periphery of the semiconductor chip 2a; and TEG wiring 7 with one end connected to the seal ring 5a and with another end extending toward an end face of an outer periphery of the semiconductor chip 2a. <P>COPYRIGHT: (C)2013,JPO&INPIT |
