| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer holding jig which easily holds thin wafers without using an adhesive, allows the wafers to be bonded to each other in the holding state by a wafer to wafer apparatus, and easily removes the bonded thin wafer without using a solvent after the wafers are bonded. <P>SOLUTION: A wafer holding jig 10 includes: a carrier 20 formed by a thermoplastic resin sheet, a carrier wafer, or a glass substrate; and an adhesive film 30. The wafer holding jig 10 adheres and fixes one surface of the adhesive film 30 to at least an outer edge region of one surface of the carrier 20 with an adhesive 40, and further adheres one surface of a wafer 60, including a plane having a dimension that fits into a plane of the adhesive film 30, to an area in a plane of the other surface of the adhesive film 30. <P>COPYRIGHT: (C)2013,JPO&INPIT |
