CURABLE COMPOSITION COMPRISING A DI-ISOIMIDE, METHOD OF CURING, AND THE CURED COMPOSITION SO FORMED

摘要

The present invention deals with a novel curable epoxy composition comprising an aromatic di-isoimide chemical compound. The di-isoimide serves effectively as a thermally activated latent catalyst in epoxy curing, thereby increasing shelf life, and avoids premature cross-linking. Novel laminated articles and printed wiring boards, including encapsulated printed wiring boards are also disclosed.