发明名称 High Performance Compliant Wafer Test Probe
摘要 An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.
申请公布号 US2012329295(A1) 申请公布日期 2012.12.27
申请号 US201213608706 申请日期 2012.09.10
申请人 CHEY S. JAY;FREGEAU DUSTIN M.;ZUPANSKI-NIELSEN DONNA S.;PRABHAKAR APARNA;SAMUDRALA PAVAN;SHAIKH MOHAMMED S.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHEY S. JAY;FREGEAU DUSTIN M.;ZUPANSKI-NIELSEN DONNA S.;PRABHAKAR APARNA;SAMUDRALA PAVAN;SHAIKH MOHAMMED S.
分类号 H05K1/02 主分类号 H05K1/02
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