发明名称 |
ELECTROPLATED LEAD-FREE BUMP DEPOSITION |
摘要 |
A method of forming a metal feature on a workpiece with deposition is provided. The method includes providing an under bump metal layer for solder of an electronic device on the workpiece, depositing a substantially pure tin layer directly to the under bump metal layer, and depositing a tin silver alloy layer onto the substantially pure tin layer. |
申请公布号 |
US2012325671(A2) |
申请公布日期 |
2012.12.27 |
申请号 |
US20100971744 |
申请日期 |
2010.12.17 |
申请人 |
KEIGLER ARTHUR;LIU ZHENQIU;ZHANG ZHONGQIN;TEL NEXX, INC. |
发明人 |
KEIGLER ARTHUR;LIU ZHENQIU;ZHANG ZHONGQIN |
分类号 |
C25D5/00;C25D5/02;C25D5/48 |
主分类号 |
C25D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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