PRINTED CIRCUIT BOARD

摘要

Provided is a printed circuit board of a novel structure which, when drag-soldering the leads of a mounting component to aligned lands, suppresses with a simple configuration excess solder between adjacent lands, suppressing the occurrence of defects such as solder bridges. This printed circuit board comprises aligned lands (14) having through-holes (12) through which the leads (20) of a mounting component (16a, 16b) are inserted. The leads (20) are drag-soldered to the lands (14), and extension lands (30a, 30b) are provided which connect to the lands (14) and extend in a direction orthogonal to the alignment direction of the lands (14).