| 摘要 |
<p>A pattern of a catalyst supporting polymer liquid for plating is formed by heating and maintaining a base material at a surface temperature of 45°C or greater (preferably 60°C or greater), and ejecting the catalyst supporting polymer liquid for plating, which contains a catalyst supporting polymer for plating, a high boiling point solvent, and a low boiling point solvent onto the base material by an inkjet system on the basis of ejection conditions in which diameter D1 for the ejected droplets, the pitch W between dots of the catalyst supporting polymer liquid for plating, and the dot diameter D2 for the liquid satisfy the relationship D1 2. In addition, after the liquid has been cured, a conductive pattern that is formed from a plating film is formed by applying the plating catalyst (or plating catalyst precursor) and carrying out plating. Thus, a preferred fine pattern can be formed avoiding occurrences of bulging and jerkiness.</p> |
