WIRING BOARD, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which easily establishes electrical continuity between wiring layers formed on both surfaces of a substrate body including a glass plate, a semiconductor device having a semiconductor chip electrically connecting with the wiring board, and a manufacturing method of the semiconductor device.

SOLUTION: A semiconductor device includes: a wiring board; and a semiconductor chip electrically connecting with the wiring board. The wiring board has: a glass plate having an opening penetrating from one surface to the other surface; a resin part formed in the opening; and through wiring penetrating through the resin part from the one surface side to the other surface side and electrically connecting a wiring layer formed on the one surface side with a wiring layer formed on the other surface side.

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