| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve commonality of mounting members for mounting different semiconductor elements having different dimensions in a semiconductor device in which semiconductor elements are mounted in element mounting recess parts of mounting members. <P>SOLUTION: Liquid insulation resin 16 less by a volume of an LED element 13 than that of an element mounting recess part 12 of a mounting member 11, is injected into the element mounting recess part 12. Then the LED element 13 absorbed to a suction nozzle 21 is descended to be immersed into the liquid insulation resin 16 in the element mounting recess part 12, the liquid insulation resin 16 in the element mounting recess part 12 is cured to hold the LED element 13 by the insulation resin 16 and to planarize a wiring path between an electrode part 14 on the LED element 13 and an electrode part 15 on the mounting element 11 by the insulation resin 16 in the state of making height positions of the electrode part 14 on the LED element 13 and the electrode part 15 on the mounting member 11 correspond to each other. A wiring 17 is formed on the wiring path by using the droplet discharge method or the printing method. <P>COPYRIGHT: (C)2013,JPO&INPIT |
