发明名称 MANUFACTURING METHOD OF CERAMIC CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a ceramic circuit board capable of improving a manufacturing yield by simply and highly accurately detecting presence and absence of circuit pattern failures at an early stage of a manufacturing process. <P>SOLUTION: A manufacturing method of a ceramic circuit board comprises the steps of: forming a through hole on a ceramic green sheet; filling the through hole of the ceramic green sheet with a conductor paste; printing a circuit pattern by the conductor paste on the ceramic green sheet; and burning the ceramic green sheet which passed each step as a single layer or a laminate. This manufacturing method performs each of the above steps per lot. For a prescribed number per lot, the circuit pattern and an auxiliary pattern which connects the circuit pattern in series are printed in advance, a conduction inspection is performed, and the step of printing the circuit pattern per lot on the basis of the conduction inspection result is performed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012256699(A) 申请公布日期 2012.12.27
申请号 JP20110128538 申请日期 2011.06.08
申请人 ASAHI GLASS CO LTD 发明人 HASHIMOTO ATSUTO;OKADA TOSHIHISA
分类号 H05K3/46;H05K3/00 主分类号 H05K3/46
代理机构 代理人
主权项
地址