POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a polishing device capable of suppressing occurrence of polishing failure.

SOLUTION: There is provided a polishing device comprising a slurry pipe 300 and a pure water supplying module 320. The slurry pipe 300 includes: an outlet 302 which extends perpendicularly downward; a first bent portion 304 which is bent perpendicularly downward at a tip extended perpendicularly upward from the outlet 302; and a second bent portion 306 which is bent in a direction at least greater in height than a horizontal direction at a tip extended perpendicularly downward from the first bent portion 304. The pure water supplying module 320 supplies pure water to the outlet 302 from outside the slurry pipe 300.

COPYRIGHT: (C)2013,JPO&INPIT