METHOD TO SOLVE POTENTIAL YIELD LOSS DUE TO METAL MIGRATION TO WIRE ROUTING NETS FROM FIDUCIARY MARKS ON PRODUCT DURING CHEMICAL-MECHANICAL-POLISHING (CMP) PLANARIZATION PROCESSING STEPS

摘要

A mask for a semiconductor process step includes an indicia section. The indicia section on the mask is used to produce a field of separated polygon elements with a defined negative space in the field providing an indicia.