发明名称 LED STRUCTURE WITH ENHANCED MIRROR REFLECTIVITY
摘要 Embodiments of the present invention are generally related to LED chips having improved overall emission by reducing the light - absorbing effects of barrier layers adjacent mirror contacts. In one embodiment, a LED chip (200) comprises one or more LEDs, with each LED having an active region, a first contact under the active region having a highly reflective mirror (206), and a barrier layer (208) adjacent the mirror. The barrier layer is smaller than the mirror such that it does not extend beyond the periphery of the mirror. In another possible embodiment, an insulator (210) is further provided, with the insulator adjacent the barrier layer and adjacent portions of the mirror not contacted by the active region or by the barrier layer. In yet another embodiment, a second contact (222,224) is provided on the active region. In a further embodiment, the barrier layer is smaller than the mirror such that the periphery of the mirror is at least 40% free of the barrier layer, and the second contact is below the first contact and accessible from the bottom of the chip.
申请公布号 WO2012177316(A1) 申请公布日期 2012.12.27
申请号 WO2012US34564 申请日期 2012.04.20
申请人 CREE, INC.;BERGMANN, MICHAEL;DONOFRIO, MATTHEW;HEIKMAN, STEN;SCHNEIDER, KEVIN, S.;HABERERN, KEVIN, W.;EDMOND, JOHN, A. 发明人 BERGMANN, MICHAEL;DONOFRIO, MATTHEW;HEIKMAN, STEN;SCHNEIDER, KEVIN, S.;HABERERN, KEVIN, W.;EDMOND, JOHN, A.
分类号 H01L33/40 主分类号 H01L33/40
代理机构 代理人
主权项
地址