| 发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT FORMATION SUBSTRATE USING THE SAME |
| 摘要 |
A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B). |
| 申请公布号 |
US2012328856(A1) |
申请公布日期 |
2012.12.27 |
| 申请号 |
US201213535552 |
申请日期 |
2012.06.28 |
| 申请人 |
MINEGISHI TOMONORI;NOGITA RIKA;KAWASAKI DAI;SUZUKI KEIKO;KONNO TAKU;HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. |
发明人 |
MINEGISHI TOMONORI;NOGITA RIKA;KAWASAKI DAI;SUZUKI KEIKO;KONNO TAKU |
| 分类号 |
H05K1/05;B32B3/10;G03F7/004;G03F7/20 |
主分类号 |
H05K1/05 |
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