SURFACE SEALANT FOR OPTICAL SEMICONDUCTOR, METHOD FOR MANUFACTURING ORGANIC EL DEVICE USING SAME, ORGANIC EL DEVICE, AND ORGANIC EL DISPLAY PANEL

摘要

The first purpose of the present invention is to provide a resin composition for sealing an optical semiconductor, wherein the raw material of a sealing resin layer has favorable curability and exhibits exceptional storage stability; preferably, the raw material of the sealing resin layer also exhibits exceptional weatherability. A surface sealant for the optical semiconductor of the first embodiment of the present invention contains (a) an epoxy resin having two or more epoxy groups in a single molecule, and (b1) a metallic complex, the metallic complex including: one or more types of metallic ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La, and Zr; a tertiary amine having the capability of forming a complex with the metallic ion, but not having an N-H bond; and an anionic ligand having a molecular weight of 17-200. The viscosity of the surface sealant, measured at 25°C and 1.0 rpm using an E-type viscometer, is 10-10000 mPa·s.