| 摘要 |
A sound insulation floor structure comprises a floor backing member, a floor finishing layer, and an intermediate layer between the floor backing member and the floor finishing layer, the intermediate layer comprising a buffer member comprising a nonwoven structure. The nonwoven structure comprises a thermal adhesive fiber under moisture which is melt-bonded to a fiber of the nonwoven structure to fix the fibers. For example, the sound insulation floor structure may comprise, in sequence, a floor backing member 1, a buffer layer 2, an air layer 3, a hard layer 4, and a floor finishing layer 5. In the floor structure, a support member 6 is disposed between the buffer layer 2 and the hard layer 4. The support member may occupy 10 to 70% of a floor area. The sound insulation floor structure prevents subsidence of a floor member due to walking, achieves comfortableness to walk, and has improved floor impact sound insulation. |
