WIRING STRUCTURES AND METHODS OF MANUFACTURING THE SAME

摘要

PURPOSE: A wiring structure and a manufacturing method thereof are provided to outgas impurities on interlayer dielectric layers by forming a dummy plug of a second contact structure on a second interlayer dielectric layer via a diffusion barrier. CONSTITUTION: A first plug(120) passes through a first interlayer dielectric layer(110) on a substrate(100). A first wiring(150) passes through a second interlayer dielectric layer(140) on the first interlayer dielectric layer. A diffusion barrier pattern exposes a part of the second interlayer dielectric layer. A second plug(182) is contacted with the first wiring via the diffusion barrier pattern. A second wiring(192) is electrically connected to the second plug.