| 发明名称 |
METHOD AND DEVICE FOR MANUFACTURING AND ASSEMBLING PRINTABLE SEMICONDUCTOR ELEMENTS |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and device for manufacturing printable semiconductor elements and assembling the printable semiconductor elements on a substrate surface. <P>SOLUTION: The device and device components form a wide range of flexible electronic devices, optoelectronic devices, and alignment of devices, on a substrate comprising polymeric materials. A stretchable semiconductor structure and a stretchable electronic device are formed which provide excellent performance in a stretched form. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012256892(A) |
申请公布日期 |
2012.12.27 |
| 申请号 |
JP20120139129 |
申请日期 |
2012.06.20 |
| 申请人 |
BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS |
发明人 |
RALPH G NUZZO;JOHN A ROGERS;ETIENNE MENARD;LEE KEON-JAE;KHANG DAHL-YOUNG;SUN YUGANG;MATTHEW MEITL;ZHU ZHENGTAO |
| 分类号 |
H01L21/02;B81C1/00;H01L21/336;H01L21/338;H01L21/77;H01L27/08;H01L27/12;H01L29/06;H01L29/786;H01L29/812;H01L31/0312;H01L31/04;H01L31/18 |
主分类号 |
H01L21/02 |
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