| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can prevent failures such as warpage and cracks, and optimize and facilitate mounting. <P>SOLUTION: A semiconductor device 100 includes a base plate 120 having one main face jointed to an insulation substrate on which a semiconductor chip and the like are mounted, and a transfer mold resin 140 provided to cover the one main face of the base plate 120, the insulation substrate, the semiconductor chip and the like, and expose the other main face of the base plate 120. A linear expansion coefficient of the base plate 120 is lower than that of copper, and a liner expansion coefficient of the transfer mold resin 140 is 16 ppm/°C or less. The transfer mold resin 140 has a shape 142 such that parts near center parts of opposed short sides of the base plate 120 are recessed to be exposed. The base plate 120 has mounting holes 122 at each portion exposed by the recessed shape 142 of the transfer mold resin 140. <P>COPYRIGHT: (C)2013,JPO&INPIT |
