| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce contamination of a substrate derived from a LTHC film. <P>SOLUTION: A manufacturing method of a semiconductor device comprises the steps of: sticking a first principal surface of a substrate to a support substrate via a photo-thermal conversion film; and removing the photo-thermal conversion film exposed on the support substrate. This manufacturing method further includes the steps of: forming a photo-thermal conversion film on the support substrate; sticking a semiconductor substrate to the support substrate so that the photo-thermal conversion film extends to the outside from the semiconductor substrate; performing contamination prevention processing for the photo-thermal conversion film; and separating the support substrate and the semiconductor substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
