| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board which allows recognition marks to be formed on a board main surface at a low cost. <P>SOLUTION: A multilayer wiring board 10 has a board main surface 31, a board back surface, and a structure in which a plurality of resin insulating layers and a plurality of conductor layers are laminated. A plurality of IC chip connection terminals 41 to which an IC chip can be connected and a plurality of capacitor connection terminals 42 to which a chip capacitor can be connected are provided on the board main surface 31 of the multilayer wiring board 10. An outermost resin insulating layer 27 exposed on the side of the board main surface 31 is provided with recognition marks 71-73 formed by differences in color density of a resin surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
