发明名称 |
RELIABLE WIRE STRUCTURE AND METHOD |
摘要 |
A wire structure, which may be configured for a semiconductor device, is disclosed. The wire may include an elongate flexible core formed of a conductor material and a cladding layer covering an outer surface of the core. The cladding layer may be a conductor. In various aspects the cladding layer and core have a different grain sizes. An average grain size of the core material may several orders of magnitude greater than an average grain size of the cladding layer material. The cladding layer may be an alloy having a varying concentration of a minor component across its thickness. Methods of forming a wire structure are also disclosed. |
申请公布号 |
US2012325517(A1) |
申请公布日期 |
2012.12.27 |
申请号 |
US201113168675 |
申请日期 |
2011.06.24 |
申请人 |
UZOH CYPRIAN;MITCHELL CRAIG;TESSERA, INC. |
发明人 |
UZOH CYPRIAN;MITCHELL CRAIG |
分类号 |
H01B5/00;H01B13/00 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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