SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION THEREOF

摘要

PURPOSE: A semiconductor device for minimizing membrane stress and a manufacturing method thereof are provided to form a corrugation part having a soft edge using an etching process. CONSTITUTION: An MEMS(micro electro mechanical system) device comprises a membrane layer(150) arranged on a substrate(100). The membrane layer is supported by a support structure including a spacer structure(210) and a protective layer(240). The membrane layer comprises a corrugation part(25) for relieving stress crossing the membrane layer. The corrugation part comprises a smooth edge without a sharp corner. The reduction of peak stress prevents damage to the membrane layer by reducing crack nucleation. The MEMS device further includes a back plate(200). A plurality of bumps(195) is arranged on the rear side of the back plate. A contact(230) is electrically combined with the back plate, the membrane layer, and the substrate. The plurality of bumps prevents the fixing of the membrane layer by minimizing a contact surface area.