| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component enabling high density assembly of the electronic component and a manufacturing method of the electronic component at low cost. <P>SOLUTION: An electronic component 1 includes: an element assembly 2; external electrodes 3, 4; and insulation layers 20, 21. The element assembly 2 has: a pair of end surfaces 2a, 2b facing each other; a pair of main surface 2c, 2d extending so as to connect the end surfaces 2a, 2b and facing each other; and a pair of side surfaces 2e, 2f extending so as to connect the main surfaces 2c, 2d and facing each other. The external electrodes 3, 4 are respectively formed on the end surfaces 2a, 2b sides of the element assembly 2 and cover parts of the main surfaces 2c, 2d and the side surfaces 2e, 2f which are located adjacent to the end surfaces 2a, 2b. At least surfaces of electrode parts 3e, 3f, 4e, 4f positioned at the side surface 2e, 2f sides in the external electrodes 3, 4 are covered by the insulation layers 20, 21. <P>COPYRIGHT: (C)2013,JPO&INPIT |
