| 摘要 |
A heat dissipation system for a computer enclosure comprises a base plate comprising a motherboard mounted thereon; and a first heat-generating component fixed on the motherboard; a front plate defining a second air outlet opening and a third air outlet opening; and a second heat-generating component mounted on the base plate; and an air guiding device fixed on the first heat-generating component; the air guiding device defining a first air inlet opening, a second air inlet opening, and a first air outlet opening, wherein airflow flows into the computer enclosure through the first air inlet opening and the second air inlet opening, the air guiding device directs the airflow toward the first heat-generating component and the second heat-generating component via the first air outlet opening, and the airflow flows out of the computer enclosure via the second air outlet opening and the third air outlet opening.
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