发明名称 DEVICE AND METHOD FOR MONITORING CHEMICAL AND MECHANICAL POLISHING ACCORDING TO SPECTRUM
摘要 <P>PROBLEM TO BE SOLVED: To provide a step of determining when a terminal point of a polishing step is achieved. <P>SOLUTION: A device and a method include detection of a terminal point according to the spectrum, adjustment of a polishing speed according to the spectrum, injection of an optical head top face, or a pad 30 with a window. In detection of the terminal point according to the spectrum, a reference spectrum, in which a terminal point determination theory based on a concrete spectrum is empirically selected, is used to achieve target thickness when the terminal point is called by applying the terminal point theory based on the spectrum. A polishing terminal point is determined using a different trace or a series of sequences. An injection system creates a layer-like gas flow to the top face of an optical head 53. A vacuum nozzle and a vacuum source are constituted so that the gas flow is formed into a gas form. The window includes a flexible plastic portion, and a crystalline or glass portion. Adjustment of the polishing speed according to the spectrum includes a step of obtaining a spectrum in a different zone on a substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012256911(A) 申请公布日期 2012.12.27
申请号 JP20120168680 申请日期 2012.07.30
申请人 APPLIED MATERIALS INC 发明人 BENVEGNU DOMINIC J;JEFFREY DRUE DAVID;BOGUSLAW SWEDEK;LEE HARRY Q;LAKSHMANAN KARUPPIAH
分类号 H01L21/304;B24B37/013;B24B49/12 主分类号 H01L21/304
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