发明名称 MANUFACTURING METHOD OF HEAT FLOW SENSOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a heat flow sensor having plural thermocouples capable of maintaining a temperature difference between the measurement representative points positioned at both sides of a sensor board to increase the heat flow sensitivity while reducing occurrence of wire break in a manufacturing process. <P>SOLUTION: Each of plural jig plates 16 is formed having plural concave metal wire guide grooves 19, on which a metal wire is wound in parallel to each other, at both edge portions 17a and 17b of respective flow openings 17 along with copper material guide grooves 18 alternately at a certain distance. The jig plates 16 are piled up in a thickness direction of the board to form a jig which is used as a mold form to be filled with an epoxy liquid resin. A harden board resin block 40 is sliced to obtain a sensor board on which second metal connecting members 11 are embedded at an equal interval. External surface of the copper wire to be wound on the copper material guide groove 18 is removed by means of primarily etching processing before being embedded in the hard board resin block so that the thermal impedance is balanced with the constantan second metal connecting member; thus the thermocouples of a matrix shape are formed and disposed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012255718(A) 申请公布日期 2012.12.27
申请号 JP20110128950 申请日期 2011.06.09
申请人 ETOU DENKI KK 发明人 ETO TETSUTARO
分类号 G01N25/18 主分类号 G01N25/18
代理机构 代理人
主权项
地址