发明名称 HARDBOARD LAMINATION METHOD AND MODULE COATED THEREWITH
摘要 <P>PROBLEM TO BE SOLVED: To enhance the yield of a product as well as the lamination quality by preventing generation of bubbles by the lamination of two hardboards. <P>SOLUTION: The method includes a coating step S1 and a pressing step S2. In the coating step S1, a coating adhesive 2 is applied to a surface of a hardboard 1, and the coating adhesive 2 has only one contact portion 21, the contact portion 21 being in one-dimensional form of a dot or line. The adhesive 2 has a coverage ratio of no less than 50% on the surface of the hardboard 1. In the pressing step S2, another hardboard 1' is brought into contact with the contact portion 21 of the adhesive 2, and the two hardboards 1, 1' are pressed together to discharge the air between the hardboards 1, 1', thereby laminating the two hardboards 1, 1' to each other. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012255134(A) 申请公布日期 2012.12.27
申请号 JP20120008715 申请日期 2012.01.19
申请人 METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE 发明人 CHEN CHIN-HO
分类号 C09J5/00;B05C17/10;B32B38/00;C09J201/00 主分类号 C09J5/00
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