| 发明名称 |
MEMS DEVICE AND FABRICATION METHOD |
| 摘要 |
A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.
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| 申请公布号 |
US2012329180(A1) |
申请公布日期 |
2012.12.27 |
| 申请号 |
US201213603007 |
申请日期 |
2012.09.04 |
| 申请人 |
STEVENSON CLAYTON LEE;GREEN JASON C.;KOEHL DARYL ROSS;DIEP BUU QUOC;TEXAS INSTRUMENTS INCORPORATED |
发明人 |
STEVENSON CLAYTON LEE;GREEN JASON C.;KOEHL DARYL ROSS;DIEP BUU QUOC |
| 分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
| 代理机构 |
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