| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid state imaging device formed by connecting a plurality of chips, capable of obtaining good global exposure type images of high quality with less noise, even if the light of the high luminance enters, a method for controlling the solid state imaging device, and an imaging device. <P>SOLUTION: In a solid state imaging device for electrically connecting a first substrate and a second substrate by a connection part for electrically connecting the first substrate and the second substrate, a pixel part in the solid state imaging device comprises a pixel contained in the first substrate and having a photoelectric conversion element; a signal line supplying a signal generated in the pixel to the second substrate; a signal storage circuit contained in the second substrate and storing the signal supplied via the signal line; and an output circuit contained in the second substrate and outputting the signal stored in the signal storage circuit. The solid state imaging device also comprises a clip circuit for clipping a voltage of the signal line so as not to be a prescribed voltage or below. <P>COPYRIGHT: (C)2013,JPO&INPIT |
