发明名称 |
METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATTACHING A CHIP TO A CHIP CARRIER, A CHIP-PACKAGING MODULE AND A PACKAGING MODULE |
摘要 |
A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.
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申请公布号 |
US2012327614(A1) |
申请公布日期 |
2012.12.27 |
申请号 |
US201113169219 |
申请日期 |
2011.06.27 |
申请人 |
MAHLER JOACHIM;MENGEL MANFRED;HOSSEINI KHALIL;KALZ FRANZ-PETER;INFINEON TECHNOLOGIES AG |
发明人 |
MAHLER JOACHIM;MENGEL MANFRED;HOSSEINI KHALIL;KALZ FRANZ-PETER |
分类号 |
H05K7/00;B32B27/00;B32B37/02;B32B37/14;B82Y40/00;H01L23/495;H05K3/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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