发明名称 Hybrid Cooling Design for Modular Systems
摘要 A system and method for chassis cooling is provided. A preferred embodiment comprises an orthogonal backplane along with a hybrid cooling air flow. One air flow is routed horizontally through aligned and suitable openings on the backplane, vertically over components to be cooled, and horizontally out of the chassis. A second air flow is routed horizontally over components and through aligned and suitable openings on the backplane before it is routed horizontally out of the chassis.
申请公布号 US2012327597(A1) 申请公布日期 2012.12.27
申请号 US201113169941 申请日期 2011.06.27
申请人 LIU JINSHUI;YU TIAN;FUTUREWEI TECHNOLOGIES, INC. 发明人 LIU JINSHUI;YU TIAN
分类号 H05K7/20;F28F13/00 主分类号 H05K7/20
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