发明名称 |
SURFACE REPAIR STRUCTURE AND PROCESS FOR INTERCONNECT APPLICATIONS |
摘要 |
A method is provided which includes providing a dielectric material having a dielectric constant of about 4.0 or less and at least one conductive material embedded therein, the at least one conductive material has an upper surface that is coplanar with an upper surface of the dielectric material and the upper surface of the at least one conductive material has hollow-metal related defects that extend inward into the at least one conductive material; and filling the hollow-metal related defects with a surface repair material.
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申请公布号 |
US2012329270(A1) |
申请公布日期 |
2012.12.27 |
申请号 |
US201213603051 |
申请日期 |
2012.09.04 |
申请人 |
YANG CHIH-CHAO;MURRAY CONAL E.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
YANG CHIH-CHAO;MURRAY CONAL E. |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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