发明名称
摘要 PROBLEM TO BE SOLVED: To provide an adhesive composition for electronic equipment excellent in long-term high-temperature resistance, and to provide an adhesive sheet for electronic equipment, an electronic part, and electronic equipment, in which the adhesive composition is used. SOLUTION: The adhesive composition for electronic equipment comprises (a) a thermoplastic resin, (b) a thermosetting resin, (c) a curing agent, and (d) an organopolysiloxane having trifunctional siloxane units. There are also provided an adhesive sheet for electronic equipment, an electronic part, and electronic equipment, in which the adhesive composition is used. Alternatively, the adhesive composition for electronic equipment comprises (a) a thermoplastic resin, (b) a thermosetting resin, (c) a curing agent, and (e) an organopolysiloxane that is a partial condensate of (d). There are also provided an adhesive sheet for electronic equipment, an electronic part, and electronic equipment, in which the adhesive composition is used. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP5109411(B2) 申请公布日期 2012.12.26
申请号 JP20070051097 申请日期 2007.03.01
申请人 发明人
分类号 C09J183/04;C09J7/02;C09J11/04;C09J133/14;C09J201/00;H01L21/52;H01L21/60 主分类号 C09J183/04
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