| 摘要 |
The component has a housing (1) that has two housing sides (15,16) extending from a housing surface area (9). The housing surface area has connection portions (7) attached to a substrate (2) with the use of solder (10). Recesses (11) are formed adjacent the connection portions of the housing, such that outer and inner solder portions (17,18) are formed surrounding the connection portions. The recesses are formed with tapered, V-shaped or trapezoidal cross-sections. A semiconductor chip (24) is mounted on the housing. |
