| 摘要 |
<p>Provided is a wiring board which has a thermal expansion coefficient close to that of silicon and is capable of having fine pitch wiring thereon. A probe card provided with the wiring board is also provided. The wiring board is provided by laminating a plurality of separately sintered ceramic substrates having wiring electrically connecting the ceramic substrates to each other and a thermal expansion coefficient of 3.2×10-6 to 5.0×10-6/°C. At least some of the ceramic substrates respectively have through holes which penetrate the ceramic substrates in the thickness direction and have plated edges.</p> |
