发明名称 |
Double-sided semiconductor structure and method for manufacturing the same |
摘要 |
A semiconductor structure (100; 200; 300) comprising; a substrate (5; 302) of semiconductor material of a first type of conductivity; a first semiconductor layer (7) set in direct electrical contact with the substrate on a first side (2) of the substrate; a second semiconductor layer (8) set in direct electrical contact with the substrate on a second side (4) of the substrate; a first active electronic device (10; 303) formed in the first semiconductor layer (7); and a second active electronic device (12; 62; 305) formed in the second semiconductor layer (8). |
申请公布号 |
EP2317553(B1) |
申请公布日期 |
2012.12.26 |
申请号 |
EP20100188931 |
申请日期 |
2010.10.26 |
申请人 |
STMICROELECTRONICS SRL |
发明人 |
MICCICHE', MONICA;GRIMALDI, ANTONIO GIUSEPPE;BAZZANO, GAETANO;FRAZZETTO, NICOLO |
分类号 |
H01L27/06;H01L29/78 |
主分类号 |
H01L27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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