| 摘要 |
<p>A method for fabricating a multilayer circuit board, including: preparing a film 1 with interlayer adhesive in which a first protective film 102 and a first interlayer adhesive 104 are stacked; preparing a first circuit board 2 having a first base 202 and a conductive post 204 protruding from the first base 202; stacking the surface of the first interlayer adhesive and the surface including the conductive post together; peeling off the first protective film 102; preparing a second circuit board 3 including a conductive pad 302 receiving the conductive post 204; and stacking and bonding the first circuit board 2 and the second circuit board 3 through the first interlayer adhesive 104 so that the conductive post 204 and the conductive pad 302 face each other, wherein in the peeling off, the first interlayer adhesive 104 at the top portion 206 of the conductive post is selectively removed while peeling off the first protective film 102.</p> |
