METHOD FOR MANUFACTURING AN ELECTRONIC PACKAGE

摘要

The method involves arranging (S1) a chip (1) on a trailed adhesive support (2), and molding (S2) resin (3) for coating the chip on the support. An island zone (10) is turned over (S3), so that the chip has exposed active face, where the island zone is formed by the assembly of the chip and resin. A conductive material is applied on the turned island zone for materializing a contact pad connecting a contact point (1a) of the chip to an exterior medium. Independent claims are also included for the following: (1) a system for manufacturing an electronic case, comprising an arranging unit (2) an electronic case comprising a chip.