| 摘要 |
A process for producing a semiconductor device comprises mounting of a semiconductor element on a circuit board via a thermosetting resin-based adhesive by means of a thermocompression process, wherein the thermocompression process is carried out under a first set of conditions (pressure = P<1> and temperature = T<1>) designed to eliminate voids present in the adhesive, and subsequently under a second set of conditions (pressure = P<2> and temperature = T<2>) designed to bring about curing of the thermosetting resin, provided that pressure P<2> of the second set of conditions is set to a lower level than the pressure P<1> of the first set of conditions. |
