| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive sheet that has a sufficiently small warpage, is provided as a sheet article and exhibits excellent functions as a dicing/die bonding tape and to provide a method for producing the same and a method for producing a semiconductor apparatus. SOLUTION: The adhesive sheet is provided with a carrier substrate and an adhesive layer arranged on the carrier substrate. The carrier substrate and the adhesive layer are mutually bonded by receiving a heat history at a fixed temperature T1. The carrier substrate has≤50mN/m surface free energy and≤2,000MPa modulus of elasticity at 25°C. The adhesive sheet satisfies a general formula (I) [(T1×α1)-(T2×α2)]≤7000ppm (I) when a coefficient of linear expansion at the fixed temperature T1(°C) of the carrier substrate isα1 (ppm/°C) and a coefficient of linear expansion at a normal temperature T2(°C) of the carrier substrate isα2 (ppm/°C). COPYRIGHT: (C)2007,JPO&INPIT |
