发明名称
摘要 PROBLEM TO BE SOLVED: To miniaturize a circuit board for mounting a switching element and to appropriately radiate heat, without changing the size of a housing case. SOLUTION: The electrical component includes: a circuit board 11 whose plane shape is formed in a rectangular shape and on which an electric circuit is mounted; a case 10 for housing the circuit board 11; a heat radiation board 40, provided on one long side of the circuit board 11 and thermally connected to the inner surface of the case 10; and an FET 30 as a switching element which configures a part of the electric circuit and is mounted on the circuit board 11 so as to position at least a part of a mold part 31 on the heat radiation board 40, by being coincided in the direction of a terminal, extending from the mold part 31 with the longitudinal direction of the circuit board 11. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5110383(B2) 申请公布日期 2012.12.26
申请号 JP20080198934 申请日期 2008.07.31
申请人 发明人
分类号 H05K7/20;F21V23/00 主分类号 H05K7/20
代理机构 代理人
主权项
地址