发明名称 |
Imaging element, imaging device, camera module and camera system |
摘要 |
Disclosed is a camera module in which an operational defect (generation of a ghost image) as a result of a reduction in thickness is eliminated. A camera module 2 includes a substrate 10 provided with a through-hole 14 for light transmission, a light receiving portion 15 provided on one side, an imaging element 11 flip chip mounted on one side of the substrate such that the light receiving portion 15 is exposed through the through-hole 14, and a shielding layer 22 on the back surface of the element on the opposite side of the light receiving portion 15, and a lens unit 12 mounted on the other side of the substrate 10. <IMAGE> |
申请公布号 |
EP1081944(B1) |
申请公布日期 |
2012.12.26 |
申请号 |
EP20000402416 |
申请日期 |
2000.09.01 |
申请人 |
SONY CORPORATION |
发明人 |
HOSHINO, KAZUHIRO;SUMI, HIROFUMI;YONEMOTO, KAZUYA |
分类号 |
H04N5/225 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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