发明名称 |
Multiple seal ring structure |
摘要 |
The present disclosure provides a method of fabricating a semiconductor device, the method including providing a substrate having a seal ring region and a circuit region, forming a first seal ring structure over the seal ring region, forming a second seal ring structure over the seal ring region and adjacent to the first seal ring structure, and forming a first passivation layer disposed over the first and second seal ring structures. A semiconductor device fabricated by such a method is also provided.
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申请公布号 |
US8338917(B2) |
申请公布日期 |
2012.12.25 |
申请号 |
US20100938272 |
申请日期 |
2010.11.02 |
申请人 |
YAUNG DUN-NIAN;LIU JEN-CHENG;LIN JENG-SHYAN;WANG WEN-DE;TSAI SHU-TING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
YAUNG DUN-NIAN;LIU JEN-CHENG;LIN JENG-SHYAN;WANG WEN-DE;TSAI SHU-TING |
分类号 |
H01L23/02;H01L21/71 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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