发明名称 Schottky device
摘要 An integrated circuit structure has a metal silicide layer formed on an n-type well region, a p-type guard ring formed on the n-type well region and encircling the metal silicide layer. The outer portion of the metal silicide layer extends to overlap the inner edge of the guard ring, and a Schottky barrier is formed at the junction of the internal portion of the metal silicide layer and the well region. A conductive contact is in contact with the internal portion and the outer portion of the metal silicide layer.
申请公布号 US8338906(B2) 申请公布日期 2012.12.25
申请号 US20080329677 申请日期 2008.12.08
申请人 YEH PING-CHUN;YEH DER-CHYANG;LIU RUEY-HSIN;LIU MINGO;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 YEH PING-CHUN;YEH DER-CHYANG;LIU RUEY-HSIN;LIU MINGO
分类号 H01L29/66 主分类号 H01L29/66
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